103 ?2010 littelfuse, inc. revised: march 25, 2010 spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. 3.5pf unidirectional tvs array for esd protection sp1010 lead-free/green series lead-free/green sp 1010 description applications zener diodes fabricated in a proprietary silicon avalanche technology protect each i/o pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes at the maximum level speci?ed in the iec 61000-4-2 international standard ( level 4, 8kv contact discharge) without performance degradation. their very low loading capacitance also makes them ideal for protection high- speed signal pins. sp1010 lead-free/green series rohs pb green features t & 4 %
* & $
? l 7 contact, 15kv air t - j h i u o j o h
* & $
1a (t p =8/20s) t - p x d b q b d j u b o d f p g q ' (typ) per i/o t - p x m f b l b h f d v s s f o u p g 1a (max) at 5v t 5 j o z v % ' / q b d l b h f (1.25mm x 1.0mm x 0.5mm) t & ' 5 q s p u f d u j p o iec61000-4-4, 40a (5/50ns) t / p u f c p p l t / f u c p p l t 6 m u s b n p c j m f 1 $ t . p c j m f q i p o f t 1 p s u b c m f o b w j h b u j p o device t 1 p s u b c m f n f e j d b m e f w j d f t . 1 1 . 1 t % j h j u b m d b n f s b pinout i/o (1) gnd gnd i/o (4) i/o (2) i/o (3) udfn-6 (1.2 5 x1.0x0. 5 mm) functional block diagram 6 5 4 1 2 3 - j g f 4 v q q p s u / p u f not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
104 revised: march 25, 2010 ?2010 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products 3.5pf unidirectional tvs array for esd protection sp1010 lead-free/green series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not impli ed. absolute maximum ratings symbol parameter value units i pp peak pulse current (t p =8/20s) 1.0 a t op operating temperature -40 to 85 c t stor storage temperature -60 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units reverse voltage drop v r i r = 1ma 7.0 7.8 8.5 v reverse standoff voltage v rwm i r 1a 6 v reverse leakage current i leak v r = 5v 0.1 1 a esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 8 kv iec61000-4-2 (air discharge) 15 kv diode capacitance 1 c d reverse bias = 0v 6 7 q ' reverse bias = 2.5v q ' / p u f t 1. parameter is guaranteed by design and/or device characterization.
105 ?2010 littelfuse, inc. revised: march 25, 2010 spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. 3.5pf unidirectional tvs array for esd protection sp1010 lead-free/green series lead-free/green sp 1010 capacitance vs. reverse bias insertion loss (s21) i/o to gnd 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 dc bias (v) capacitance (pf) -30 -25 -20 -15 -10 -5 0 5 0 0 0 0 1 0 0 0 1 0 0 1 0 1 frequency (mhz) attenuation (db) application example shield ground sp1010-04utg outside world input keyboard controller d1 d2 d3 d4 signal ground
106 revised: march 25, 2010 ?2010 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products 3.5pf unidirectional tvs array for esd protection sp1010 lead-free/green series package dimensions - udfn-6 (1.25x1.0x0.5mm) udfn-6 (1.2 5 x1.0x0. 5 mm) symbol millimeters inches min max min max a 0.45 0.55 0.018 0.022 a1 0.00 0.05 0.000 0.002 a3 3 & ' 3 & ' b 0.15 0.25 0.006 0.010 d 1.20 0.047 0.051 d2 ---- e 0.95 1.05 0.041 e2 ---- e 3 & ' 3 & ' l 0.25 0.010 0.014 d e b 1 2 3 6 5 4 t op view pin 1 index area a a 1 2 3 5 4 6 l pin 1 chamfer 0.10 x 4 5 0.0 5 c bottom view 0.0 5 c 0.0 5 c b a1 a3 c seating plane side view 0.10 c a m b 0.0 5 c m re?ow condition 1 c o ' s f f b t t f n c m z pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak ? $ t f d p o e n b y t s(max) to t l - ramp-up rate ? $ t f d p o e n b y re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5 c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 2 5 c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters
107 ?2010 littelfuse, inc. revised: march 25, 2010 spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. 3.5pf unidirectional tvs array for esd protection sp1010 lead-free/green series lead-free/green sp 1010 embossed carrier tape & reel speci?cation C udfn-6 (1.25x1.0x0.5mm) ordering information part number package marking min. order qty. 4 1 6 5 ( v % ' / y y n n
h4 product characteristics lead plating 1 s f 1 m b u f e ' s b n f lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability 6 - 7 / p u f t 1. all dimensions are in millimeters 2. dimensions include solder plating. % j n f o t j p o t b s f f y d m v t j w f p g n p m e n b t i n f u b m c v s s " m m t q f d j m d b u j p o t d p n q m z u p + & % & $ 4 1 & $ . 0 * t t v f " 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 1 b d l b h f t v s g b d f n b u u f m o j t i 7 % * part numbering system part marking system sp 1010 04 u t g silicon protection array series number of channels package u: udfn-6 t= tape & reel g= green C h4 h 4 product series number of channels h = sp1010 k0 a0 b0 p2 d1 p0 t f e w d symbol millimeters inches min max min max e 1.65 1.85 0.06 0.07 f 0.14 0.14 d1 0.50 0.65 0.02 d . * / . * / p0 4.10 0.15 0.16 10p0 40.0 +/- 0.20 1.57 +/- 0.01 w 7.90 p2 1.95 2.05 0.08 0.08 a0 1.09 1.19 0.04 0.05 b0 1.42 1.52 0.06 0.06 k0 0.71 0.81 t 0.25 typ 0.01 typ
|
